İletişim
Fiyatı:
37213TL
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0.053 Kg
- :Охлаждащи системи
- :TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
- :With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
- :Density: 2.9 g/cm3
- :Viscosity: 47 Pa-s
- :Thermal impedance: 0.035°C -in2/W
- :Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
- :This thermal compound application kit includes a set of easily-applied tools for immediate use.
